銘盛電子◆◆◆回收美國(guó)ALTERA品牌IC，回收美國(guó)AMD品牌IC，回收愛特梅爾品牌IC，回收美國(guó)安華高品牌IC，回收CIRRUS凌云品牌IC，回收CYPRESS塞樸拉斯IC，回收飛思卡爾半導(dǎo)體IC，回收日本日立品牌IC，回收合泰IC二三極管，回收現(xiàn)代三星品牌內(nèi)存IC。電話13631665055 肖先生 QQ 1073735185
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Push-Pull Output Comparator,1.4 V,SOT-23-5,Micro-Power, CMOS Input, RRIO,SGM8701YN5G/TR,SGMICRO
電壓轉(zhuǎn)換器,DC/DC,up to 39V output, 1.5A,TSOT23-6, 2.9x2.8mm,step up,KTD257M,KINETIC
模擬開關(guān),SPDT Switch,2×2×0.55 mm,12 pin,N/A,SKY13472-460LF,SKYWORKS
電壓轉(zhuǎn)換器,DC/DC converter,250mA,-6.4V,12pin UDFN,3×3×0.55 mm,DW8722,DONGWOON
環(huán)境光和距離感應(yīng)器,3in1 ALPS,N/A,3.94x2.36x1.35,N/A,STK3310,SITRONIX
雙通道DCDC,2ch DCDC,+5V and -5V,2.15x1.82mm WLCSP,N/A,ISL98607,INTERSIL
環(huán)境光和距離感應(yīng)器,3in1 ALPS,N/A,ALGA 3.94x2.36x1.35mm,N/A,STK3311,SITRONIX
射頻開關(guān),HIGH POWER SP3T SWITCH,Low Frequency - 2.5GHz,2.0x2.0x0.55mm,12 pin,N/A,RF1131,RFMD
線性電源,LDO,N/A,DFN(PLP)1010-4,1.2V 300mA,RP114K121D-TRB,RICOH
電壓穩(wěn)壓器,low dropout regulator,1*1*0.55 mm,4 pin,150mA,2.2V,SOT1194-1,N/A,LD6805K/22H,NXP
電壓穩(wěn)壓器,LDO,N/A,DFN-4,N/A,S-1339D12-A4T2U3,SEIKO
穩(wěn)壓器,LDO,UTDFN-1×1-4L,2.8V,250mA,1.0×1.0×0.6mm,N/A,SGM2031-2.8YUDH4G/TR,SGMICRO
模擬電視芯片,ATV chipset,demodulates PAL,NTSC and SECAM,QFN,N/A,NMI601BBA,NEWPORT
集成電路,Adjustable LDO,Synchronous StepDown Converter,SOT-23-5L,N/A,SGM6006-ADJYN5G/TR,SGMICRO
集成電路,Mobile Power and,Battery Management Unit,100 ball FBGA,,,5.5×5.5mm,0.5pitch,BCM59042,BROADCOM,
實(shí)時(shí)時(shí)鐘和日歷芯片,Real-time clock/calendar,5.1×3.1×1.1 mm,TSSOP8,N/A,OM8563TS,NXP
音頻處理器,Voice Processor,2.5×2.5×0.798 mm,25-pin WLCSP,N/A,FM34-CE-500,FORTEMEDIA
應(yīng)用處理器,Application Processor,FCCSP,518.0 Balls,12.6×12.6×1 mm,0.40 mm,Security,N/A,MT6513TMV/B,MTK
3態(tài)輸出總線緩沖器,Bus Buffer 3-State Output,2×2.1×0.9mm,SSOP5-P-0.65A,N/A,TC7SZ125FU,TOSHIBA
LED 驅(qū)動(dòng),WLED Driver,3×3mm,10Pin QFN,14WLED,2line,TPS61150ADRCR,TI
微機(jī)械運(yùn)動(dòng)傳感器,MEMS motion sensor,4×4×0.9mm,QCN-24,N/A,PS-MPU-3050C,INVENSENSE
集成開關(guān),Processor Supply with I2C,2×2×0.625 mm,DSBGA 16 pins,N/A,TPS62361BYZHR,TI
WIFI/Bluetooth/GPS/FM芯片,WLAN/BT/GPS/FM Single chip,Wlan/BT/GPS/FM,173pin,13×14mm,0.40 mm,Non-Security,N/A,WL1281CYFVR,TI
低功耗音頻解碼器,LOW-POWER AUDIO CODEC,6×6×1.0 mm,120-pin PBGA,N/A,TWL6040A2ZQZ,TI
微處理器復(fù)位電路,Microprocessor Reset Circuit,3.0×2.5×0.7 mm,SOT-23,2.63 V,AZ809ANRTR-G1,BCD
電壓轉(zhuǎn)換器,DC/DC,2.9×2.8mm,SOT-23-5,1.2A,AP3407KTR-G1,BCD
實(shí)時(shí)時(shí)鐘和日歷芯片,I2C Real Time Clock/Calendar,N/A,MSOP8,N/A,HYM8563S,HAOYU
電壓轉(zhuǎn)換器,DC/DC,3×4.9mm,MSOP-8,step up,LM3224MM-ADJ,NATIONAL
鋰電池充電IC,Buck Li-ion Charger,3×3mm,TDFN-10,2A,LP28300-QVF,LOWPOWER
加速度傳感器,Digital Accelerometer,3×3×1mm,QFN-16,N/A,MMA8452QR1,FREESCALE
雙路輸入復(fù)位發(fā)生器,2 Input Reset Generator,1.45×1.0×0.4mm,uLLGA-6,N/A,CAT872-30ULGT3,ON SEMI
音頻放大器,Audio PA,2×1.5mm,12 bump micro,N/A,LM48556TLX,NATIONAL
無(wú)線收發(fā)芯片,Translating transceiver,XQFN12(SOT1174),1.7×2×0.5mm,0.40 mm,N/A,NTB0104GU12,NXP
電壓轉(zhuǎn)換器,DC/DC,3.02×2.95×1.2mm,SOT23-6L,100mA,CP2128,CHIPHOMER
CMMB解調(diào)芯片,Integrated CMMB Receiver,5×5×1.13 mm,TFBGA-49,N/A,IF228,INNOFIDEI
濾波器,low-noise amplifier,Wideband silicon germanium,1.575 GHz,1×1×0.5mm,6.0 PINs,N/A,BGU7003,NXP
集成電路,Regulated charge pump,N/A,SOT23-6L,Non-Seucurity,OCP8130W50AD,ORIENT-CHIP
LED 驅(qū)動(dòng),LED Driver,2×2×0.9 mm,DFN2x2-8L,4Channel,20 mA,AW9364DNR,AWINIC
LED 驅(qū)動(dòng),LED Driver,3×3mm,DFN3×3-10L,6line,20mA,SGM3139YD10G/TR,SGMICRO
多媒體芯片,Multimedia Device ES1.1,1.2GHz,12.1×12.1×0.7mm,S-PBGA-N547,N/A,4460BCBSR,TI
基帶芯片.集成電路,Multimedia Device,S-PBGA-N547,547 Balls,12.00×12.00×0.90 mm,0.4 mm,Non-Security,ES1.0 ES1.1,1.5GHz,4460B5CBS,TI
集成電路,POWER MANAGEMENT UNIT,,WLCSP,6×4 Array,2.53×1.71mm,24-Bump,,,,,RF6561TR7,RFMD,
集成電路,3G+ PowerSmart,POWER PLATFORM PA,,6.6×13.7×1.02mm,,,,,,RF6261TR13,RFMD,
電源管理芯片,Power Management Unit,187-pin nFBGA,7×7×1.0mm,0.40 mm,N/A,TWL6030B1ADCMR,TI
電源管理芯片,Power Management Unit,16-Bump WLCSP,1.73×1.73×0.606mm,0.40 mm,N/A,RF6590,RFMD
前端模塊,Diversity Front End Module,Band1(4)/2/5/8/12(17),26 Pin,4.7×3.9×1.0 mm,For NA-ATT,HFQSWEJUA-138,MURATA
前端模塊,Diversity Front End Module,For EU : Band1/3/5/7/8/20,26 Pin,4.7×3.9×1.0 mm,N/A,HFQSWEJUA-136,MURATA
平臺(tái)主芯片,Mobile Station Modem,576 NSP,576.0 Balls,11×11×1.05 mm,0.40 mm,Non-Security,N/A,MSM-7627A-0-576NSP-MT-01-0,QUALCOMM
WIFI/Bluetooth芯片,WLAN+BT chip,WLAN IEEE 802.11b/g/n,60pin,8.2×7.3×1.25 mm,N/A,Security,Broadcom BCM4329 WLAN+BT,WBB23BOKR05,SAMSUNG
前端集成模塊,WLAN/BT FEM,802.11b/g/n WLAN/BT FEM,16pin,3.0×3.0×0.45 mm,N/A,TQM679002,TRIQUINT
集成電路,3V TD-SCDMA/W-CDMA LINEAR,3×3×1.0mm,10pin,N/A,RF7234,RFMD
射頻開關(guān),SPDT Switch,1.5×1.5mm,MLPD 6-pin,N/A,SKY13319-374LF,SKYWORKS
四工器,Quadplexer,PCS and Cellular band,Cellular/PCS Duplexer Rx&Tx,3×5×1.05mm,N/A,N/A,ACFM-7110-TR1,AVAGO
負(fù)載開關(guān),Loading Switch,3.1×3.0mm,SOT23-5,500mA,LPW5206B5F,LOWPOWER
天線開關(guān)模塊,Antenna Switch Module,SP8T,2.85- 4.7 V,PG-VCCN-20-1(3.2×2.8×1mm),2GSM Tx and 6WCDMA-TRx,BGSF18DM20,INFINEON
模擬開關(guān),DPDT AN/Alog Switch,1.8×1.4mm,UTQFN 10L,N/A,SGM7227YUWQ10G/TR,SGMICRO
模擬開關(guān),SPDT AN/Alog Switch,2×2mm,QFN, 6-pin,N/A,RF1200,RFMD
穩(wěn)壓器,LDO,N/A,SOT-23-5,2.8V,150mA,RP119N281D-TR-FE,RICOH
電壓調(diào)節(jié)器,LDO,N/A,SOT-23-5,1.8V,150mA,RP119N181D-TR-FE,RICOH
穩(wěn)壓器,LDO,1.0×1.0mm,PLP1010-4,3.0V,150mA,RP103K301D-TR,RICOH
雙路穩(wěn)壓器,Dual LDO,3.02×2.95mm,TSOT-23-6L,250mA,1.2V/1.8V,SGM2027-AAYTN6G/TR,SGMICRO
穩(wěn)壓器,LDO,2.9×2.8mm,SOT-23-5,3.0V,500mA,RT9013-30GB,RICHTEK
穩(wěn)壓器,LDO,2.9×2.8mm,SOT-23-5,2.5V,500mA,RT9013-25GB,RICHTEK
穩(wěn)壓器,LDO,2.9×2.8mm,SOT-23-5,500mA,1.2V,RT9013-12GB,RICHTEK
穩(wěn)壓器,LDO,3.1×3.0mm,SOT-25,500mA,3.3V,RT9167A-33GB,RICHTEK
穩(wěn)壓器,LDO,2.9×2.8mm,SOT-23-5,2.8V,500mA,RT9013-28GB,RICHTEK
無(wú)線收發(fā)芯片,EDGE/HSPA+ Transceiver IC,PG-WFWLB-138-2,5×5.3×0.8mm,0.40 mm,N/A,PMB5712A1,INFINEON
無(wú)線收發(fā)芯片,RF Transceiver IC,196 NSP,7.8×6.2×1.0mm,0.40 mm,N/A,RTR-8600-0-196NSP-TR-0A-0,QUALCOMM
射頻放大芯片模組,RF PA Module,Broadband PAM for Band 1,2,5,8,14 pad,3.0×4.2×0.9 mm,N/A,SKY77758,SKYWORKS
射頻放大芯片,RF PA,N/A,Small, low profile package,3*3*0.85 mm,N/A,SKY77709,SKYWORKS
射頻放大芯片,RF PA,Quad-Band GSM/EDGE,15pin,5.00×3.50×0.90mm,N/A,TQM7M5050,TRIQUINT
射頻功率放大器,RF PA,UMTS Band 4 PA,10pin,3×3×0.9 mm,N/A,ACPM-5504-TR1,AVAGO
射頻功率放大器,RF PA,CDMA Dual Band Power Amplifier,14pin,4×5×0.9mm,N/A,ACPM-7353-TR1,AVAGO
MOS FET功放模塊,MOS FET PA module,Quad-Band T×/semi-Quad R×,34pin,6.0×8.0×1 mm,With Antenna Switch,RPF89011B,RENESAS
射頻功率放大器,RF PA,TD-SCDMA 1880-1920M/2010-2025M,10pad,3.0×3.0×0.85mm,N/A,SKY77198-12,SKYWORKS
MOS FET功放模塊,MOS FET PA module,Dual band Antenna Switch,34pin,6.0×8.0×1.0(max)mm,N/A,RPF89007B,RENESAS
射頻功率放大器,RF PA,WCDMA/HSDPA/HSUPA/HSPA+/LTE,10pin,3.0×3.0×0.9 mm,LTE-Band V (824-849MHz),SKY77704,SKYWORKS
音頻放大器,Audio PA,1.42×1.42mm,9-ball WCSP,2W,class D,SN2145IY09E,SI-EN
內(nèi)存芯片,MCP Memory,N/A,32 Gb,48 pin TSOP,20×12×1.2 mm,0.5 mm,3.3 V,NAND,H27UBG8T2BTR-BC,HYNIX
內(nèi)存芯片,Memory,Spi Flash,128Mbit,WSON8 6*5-mm,6.00×5.00×0.75 mm,1.27 mm,1.8 V,N/A,W25Q128FWPIM,WINBOND
內(nèi)存芯片,Memory,64M bit serial flash,,N/A,MLP8,6×5 mm,1 mm,1.8 V,N/A,N25W064A11EF640F,MICRON
內(nèi)存芯片,MCP Memory,e.MMC+LPDDR2 S4 SDRAM,4 GB e.MMC+4 Gb(256 Mb x 16),FBGA162 ball,11.5×13×1.0 mm,0.5 mm,N/A,N/A,KMNJS000FM-B205,SAMSUNG
內(nèi)存芯片,MCP Memory,DDR2 Mobile RAM,8Gb DDR2 Mobile RAM,216-ball FBGA,12×12×0.8mm,0.40 mm,1.2 V,POP,EDB8164B3PF-1D-F,ELPIDA
內(nèi)存芯片,MCP Memory,LPDDR2-S4 SDRAM+LPDDR2-S4,4Gb+ 4Gb,216-ball FBGA,12×12×0.8mm,0.40 mm,1.2 V,PoP,K3PE7E700M-XGC1,SAMSUNG
內(nèi)存芯片,MCP Memory,NAND Flash+Mobile DDR SDRAM,2Gb (128M x16)+1Gb (64M x16),153-ball FBGA,8×9×1.0mm,0.50 mm,1.8 V,N/A,K522H1HACF-B050,SAMSUNG
內(nèi)存芯片,MCP Memory,eMMC,4GB Emmc,153-ball FBGA,11.5×13×1.0mm,0.80 mm,1.8 V,MLC,KLM4G1FE3B-B001,SAMSUNG
內(nèi)存芯片,MCP Memory,eMMC,8GB Emmc,153-ball TFBGA,11.5×13×1.0mm,0.50 mm,1.8 V,N/A,KLM8G2FE3B-B001,SAMSUNG
內(nèi)存芯片,MCP Memory,NAND Flash+mobile DDR,2Gb+1Gb,P-TFBGA130-0809-0.65AZ,8.0×9.0×1.0mm,0.650 mm,1.8 V,N/A,TYAB0A111254KA20,TOSHIBA
內(nèi)存芯片,MCP Memory,NOR Flash+UtRAM2,128Mb +64Mb UtRAM2,84-ball FBGA,8×11.6×1.2mm,0.80 mm,1.8 V,N/A,K5L2866ATC-BQ12,SAMSUNG
內(nèi)存芯片,MCP Memory,Flash+ PSRAM,32Mb(2M×16)+8Mb (512K×16),56-ball BGA,7×9×1.2mm,0.80 mm,1.8 V,N/A,FM91L03208UA-77BGE2B,ESMT
內(nèi)存芯片,MCP Memory,Flash+ PSRAM,32Mb(2M×16)+8Mb (512K×16),56-ball BGA,7×9×1.2mm,0.80 mm,1.8 V,N/A,FM91L03208UA-77BGE2B,ESMT
無(wú)線收發(fā)芯片,Transceiver,LFCSP-40,6×6×0.85mm,0.50 mm,N/A,AD6546,ANALOG DEVICES
基帶芯片,Baseband Chipset,745PNSP,745 Balls,12×12×0.78mm,0.4 mm,N/A,W/O HDCP，1.4GHz,MSM-8230-2-745PNSP-TR-02-0-AA,QUALCOMM
基帶芯片,Baseband Chipset,745PNSP,745 Balls,12×12×0.78mm,0.4 mm,N/A,W/O HDCP,MSM-8230-2-745PNSP-TR-02-0,QUALCOMM
基帶芯片,集成電路,Multimedia Device,S-PBGA-N547,547 Balls,12.00×12.00×0.90 mm,0.4 mm,Security,HS with TI dummy keys,X4460B5MCBS,TI
基帶處理芯片,Multimedia Baseband Processor,344-pin discrete package,N/A,11×11x1.0 mm,0.50 mm,Non-Security,N/A,21654GB1IFFBG,BROADCOM
集成電路,HEDGE Baseband Processor,FBGA,415.0 Balls,11×11 mm,N/A,Security,N/A,BCM2157B0KFB01G,BROADCOM